Shining Point Industry Company
Main Products: bonding capillary, ceramic-capillary
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Company Overview
The ceramic capillary Tools from Die Attach to Wire Bonding. This includes Die Attach & Vacuum Pickup Tools, Flip Chip Tools and Semiconductor Wire Bonding Capillaries & Wedges. We offer standard designs as well as custom designs for customer specific packaging requirements and challenges. Dedicated and highly qualified sales and service engineers and application specialists ensure that customers receive professional service and support at all times from the design phase to starting mass production We can supply die pickup tools, wire bonding wedges, wire bonding capillaries, EFO wands, epoxy stamping and dispensing nozzles, capillary unplugging wires, ribbon wire bonding tools, TAB and Waffle bonding tools, die collets for active face die, peripheral edge pickup tools and a wide range of custom solutions is also available.
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AgentBusiness Type
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2021Year Established
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3,000-5,000 square metersFactory Size
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US$1 Million - US$1.5 MillionAnnual Export Value
Company Detail
Transparency is the foundation of our partnership. Below is a comprehensive overview of our operational metrics, from business scale to global market reach, giving you a clear picture of our capabilities.
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201 - 300 People Total Employees
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51-100 People Sales Staff
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10-20 People Quality Inspectors
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QS9000, ISO14000, TS16969, ISO19011:2000, OHSAS18001 Product Certifications
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US$1 Million - US$1.5 Million Annual Export Value
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North America, Eastern Europe, Southeast Asia, Mid East, Western Europe, South Asia Main Markets
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Shenzhen, Shanghai Port of Shipment
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Intrinsic Semiconductor Main Industry
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Our ServicesWe can supply die pickup tools, wire bonding wedges, wire bonding capillaries, EFO wands, epoxy stamping and dispensing nozzles, capillary unplugging wires, ribbon wire bonding tools, TAB and Waffle bonding tools, die collets for active face die, peripheral edge pickup tools and a wide range of custom solutions is also available.